1. Basic Info Layers / Size / Quantity
Layers *
Board Size *
×
mm
Single board (max 600×500)
Quantity *
Pcs / Design
Designs per Panel
design(s) (different boards within the file)
Board Thickness
mm
2. Process Copper / Trace / Mask / Surface Finish
Outer Copper
Inner Copper
Min. Trace/Space
mil
Min. Hole Size
mm
Solder Mask
Silkscreen
White
Black
Via Process
Surface Finish
Impedance Control
NoYes
3. Special Processes Via in Pad / Half-Hole / Edge Wrap / Bevel / Press-fit
Via in Pad
NoYes
Gold Finger Bevel
NoYes
Half-Hole (Castellated)
None1 Side2 Sides3 Sides4 Sides
Edge Wrap
None1 Edge2 Edges3 Edges4 Edges
Press-fit Holes
NoYes
Lead Time
Standard schedule, to be confirmed by the factory after order placement
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Estimated Total
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